Electronic and electrical products have the characteristics of small size, light weight, and high performance. The application of bonding technology in the assembly of such products can fully reflect its characteristics. In the 20th century, with the development of polymer science, many types of adhesives with excellent performance have been developed. Although there are many types of adhesives used for the assembly of electronic equipment, their dosage only accounts for more than 1% of the total adhesive amount, and there are many performance requirements for adhesives, The time period for evaluating the performance of the adhesive is also very long.

Due to the miniaturization of electronic instruments, a composite substrate is being developed for printed wiring boards (PCBs), in addition to the very useful multi-layer wiring boards. The insulation materials used for wiring boards include paper epoxy resin, glass epoxy resin, and insulated metal plates, which can be selected based on their purpose, price, and performance. The adhesive used for copper foil bonding as a conductor is shown in Table 12. Additionally, when using a coating as a conductor, corrosion treatment is often carried out on the surface to improve its adhesion